PURPOSE: To facilitate the removal of a photoset part even if said part is subjected to a plating treatment by incorporating a specific compd., carboxyl group-contg. film formability imparting polymer, org. halogen compd., and a photoinitiator or photoinitiator system compd. into the above compsn. and specifying the compounding ratios thereof.
CONSTITUTION: The compd. contains (a) the compd. expressed by formula I, (b) the carboxyl group-contg. film formability imparting polymer, (c) the org. halogen compd., and (d) the photoinitiator or photoinitiator system compd. The compounding ratios thereof are 5W90pts.wt. component (a), 10W95pts.wt. component (b), 0.1W10pts.wt. component (c), and 0.1W10pts.wt. component (d) per 100pts.wt. of the total wt. of (a)W(b). (In the formula, R1WR3 denote a hydrogen atom or methyl group; (m) and (n) denote 1W3 integer. This photosensitive resin compsn. allows the rapid and easy removal (stripping) of the photoset part even after said part is subjected to the plating treatment. The workability is thus greatly improved.
MINAMI YOSHITAKA
KAKUMARU HAJIME
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