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Title:
感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品
Document Type and Number:
Japanese Patent JP7073252
Kind Code:
B2
Abstract:
Provided are: a photosensitive resin composition which exhibits excellent pattern forming properties even when forming a photosensitive layer having a thickness of at least 70 µm; a photosensitive resin film; a method for producing a cured product; a laminate; and an electronic component. The present invention relates to a photosensitive resin composition which includes: component (A), namely a high molecular weight polymer having photopolymerizable functional groups and carbon-nitrogen bonds; component (B), namely a low molecular weight polymer having photopolymerizable functional groups and carbon-nitrogen bonds; and component (C), namely a photopolymerization initiator. Component (B) includes a low molecular weight polymer having acryloyl groups as the photopolymerizable functional groups. The present invention also relates to: a photosensitive resin film which uses said photosensitive resin composition; a method for producing a cured product; a laminate; and an electronic component.

Inventors:
Keiji Ono
Mao Narita
Shu Hashimoto
Shuichi Mori
Shinjiro Fujii
Application Number:
JP2018508291A
Publication Date:
May 23, 2022
Filing Date:
March 31, 2016
Export Citation:
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Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
G03F7/027; G03F7/029
Domestic Patent References:
JP2012215874A
JP2012215872A
Foreign References:
WO2010123082A1
WO2012141275A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Koshita
Hiroshi Abe
Kazuyuki Yoshizumi