Title:
感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP7251323
Kind Code:
B2
Abstract:
To provide: a photosensitive resin composition excellent in resolution of a via, adhesive strength to plated copper, and insulation reliability; a photosensitive resin film comprising the photosensitive resin composition; a multilayer printed wiring board using the photosensitive resin composition or the photosensitive resin film; and a semiconductor package using the multilayer printed wiring board.SOLUTION: The photosensitive resin composition contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (B) an inorganic filler, and (C) a photopolymerization initiator. The inorganic filler (B) contains (B1) an aminosilane-treated inorganic filler and (B2) a vinylsilane-treated inorganic filler. The ratio of the aminosilane-treated inorganic filler (B1) to the total amount of the aminosilane-treated inorganic filler (B1) and the vinylsilane-treated inorganic filler (B2) is 0.5-45 mass%.SELECTED DRAWING: None
Inventors:
Yayoi Sawada
Abe Kidai
Akihiro Nakamura
Aya Momozaki
Abe Kidai
Akihiro Nakamura
Aya Momozaki
Application Number:
JP2019102940A
Publication Date:
April 04, 2023
Filing Date:
May 31, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
G03F7/004; G03F7/027; G03F7/032; G03F7/20; H05K3/46
Domestic Patent References:
| JP8106163A | ||||
| JP8122517A | ||||
| JP201273601A | ||||
| JP2011164270A | ||||
| JP10133370A | ||||
| JP2015125710A | ||||
| JP2017116652A |
Foreign References:
| WO2017122460A1 | ||||
| WO2018225441A1 | ||||
| US20170052446 | ||||
| US20100159138 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office