Title:
感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP7354664
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition having excellent dielectric properties and a method for producing the same, and provide a photosensitive resin film, a multilayer printed board and a method for producing the same, and a semiconductor package each of which uses the photosensitive resin composition.SOLUTION: The present invention relates to a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a maleimide compound having an N-substituted maleimide group, and a method for producing the same. The present invention also relates to a photosensitive resin film, a multilayer printed board and a method for producing the same, and a semiconductor package each of which uses the photosensitive resin composition.SELECTED DRAWING: None
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Inventors:
Mika Kimura
Kohei Abe
Kohei Abe
Application Number:
JP2019148812A
Publication Date:
October 03, 2023
Filing Date:
August 14, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
G03F7/027; C08F290/06; C08G59/20; G03F7/004; G03F7/032; G03F7/033; G03F7/20; H05K1/03; H05K3/46
Domestic Patent References:
| JP2019066793A | ||||
| JP2018021978A | ||||
| JP2010204298A |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office