To ensure superior adhesion, satisfactory printing resistance and chemical resistance by incorporating a specified compd. as a component of a resin binder.
In this photosensitive resin compsn., one or more kinds of compds. represented by the formula are contained as components of a resin binder. In the formula, each of R1 and R2. is H, halogen, alkyl, alkoxy or aryl, (n) is 0-50 and the mean value (n) is 0-20, preferably 0-10. The average mol.wt. of the resin binder is 220-4,000, preferably 240-2,000 and the resin binder may be obtd. by allowing phenol to react with dicyclopentadiene. A sensitizer used is preferably an o-naphthoquinonediazido compd. such as an ester compd. of o-naphthoquinonediazidosulfonic acid and a low molecular compd., oligomer or polymer having phenolic hydroxyl groups.
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SUZUKI RIHOKO
