Title:
感光性樹脂組成物およびプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP7439307
Kind Code:
B2
Abstract:
[Problem] To provide a photosensitive resin composition that has, even when being adjusted to have a low viscosity, excellent developing properties and ability to cover edge portions of a circuit of a printed wiring board when being applied. [Means] The photosensitive resin composition according to the present invention is characterized by containing a carboxyl group-containing resin, a thermosetting resin, a photosensitive monomer, and an organic solvent, and is characterized in that, when the viscosity of the photosensitive resin composition at 25°C is defined as A (dPa·s) and the volume resistivity value of the photosensitive resin composition at 25°C is defined as B (MΩ) and when the viscosity of the photosensitive resin composition is adjusted to A1=5.0 (dPa·s) and A2=1.5(dPa·s) by using propylene glycol monomethyl ether, B1 (MΩ) that represents the volume resistivity value at A1 and B2 (MΩ) that represents the volume resistivity value at A2 satisfy formula: 1.4≤(A1-A2)/(B1-B2)≤40.
Inventors:
Kaoru Manaka
Application Number:
JP2022578444A
Publication Date:
February 27, 2024
Filing Date:
January 26, 2022
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
G03F7/027; G03F7/004; H05K3/28
Domestic Patent References:
| JP2006131679A | ||||
| JP2010175608A | ||||
| JP2006220861A |
Attorney, Agent or Firm:
Manabu Miyajima
Mari Asano
Kazuma Kojima
Mari Asano
Kazuma Kojima
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