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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND RESIST IMAGE FORMING METHOD
Document Type and Number:
Japanese Patent JPH06348015
Kind Code:
A
Abstract:

PURPOSE: To provide a photosensitive resin compsn. having high sensitivity to active energy beams such as far UV, X-rays or electron beams and capable of giving a positive type resist image excellent in resolution and a resist image forming method using the photosensitive resin compsn.

CONSTITUTION: The objective photosensitive resin compsn. contains a resin soluble in an aq. alkali soln., tris(methanesulfonyloxy)benzene, a compd. having an acid-decomposable group and forming a compd. having increased solubility in the aq. alkali soln. by the presence of an acid and cyclic ketone and/or alkoxycarboxylic ester as a solvent. This photosensitive resin compsn. is applied on a substrate, dried, exposed, heated and developed to form a resist image.


Inventors:
KOIBUCHI SHIGERU
KATO KOJI
HASHIMOTO MICHIAKI
SAKAMIZU TOSHIO
SHIRAISHI HIROSHI
Application Number:
JP14047393A
Publication Date:
December 22, 1994
Filing Date:
June 11, 1993
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
HITACHI LTD
International Classes:
G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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