To provide a photosensitive resin composition excellent in adhesion, with the view to the situation that a pattern of a resin composition used so far peels from a base because of weak adhesion to the base in the case of using an aqueous organic alkali solution as a developer, particularly a 2.38% aqueous solution of tetramethylammonium hydroxide generally used in semiconductor use, accordingly processing can be performed only with a special developer having a concentration lower than 2.38%.

The photosensitive resin composition contains (A) a cycloolefin resin having an acidic group, (B) a photoacid generator, (C) a compound having a reactive group capable of bonding to the acidic group of the component (A) at ≥130°C, (D) a silane coupling agent, and (E) an antioxidant having S in a molecule. A semiconductor device manufactured using the photosensitive resin composition is also provided.