To provide photosensitive polyimides excellent in preservable stability of varnish and stability left standing in a film forming process and having good ability to form a high definition pattern and to provide a semiconductor element using the polyimides.

This photosensitive resin compsn. consists of a polyamide acid represented by formula (where X is a tetravalent org. group and Y is a divalent org. group) and a multifunctional photo-amine generating compd. Amine groups produced from the photo-amine generating compd. by a photoreaction bond to the carboxyl groups of the polyamide acid where the amine groups are reperesented by the formula and the solubility of the polyamide acid in a developer lowers remarkably after the photoreaction.