PURPOSE: To obtain a photosensitive resin composition, containing respective specific high polymer binder, unsaturated compound, amino resin and sensitizer (system), capable of forming solder masks having excellent resolution, solder heat resistance and boiling resistance, etc., and suitable for producing printed circuit boards, etc.
CONSTITUTION: A photosensitive resin composition obtained by blending (A) 100pts.wt. high polymer binder soluble in aqueous solutions of alkalis and insoluble in water (preferably methyl methacrylate/ethyl acrylate/methacrylic acid copolymer) with (B) preferably 40W380pts.wt. unsaturated compound prepared by reacting triglycidyl isocyanurate with an unsaturated group-containing monocarboxylic acid at 0.9W1.05 ratio of acid quiv./epoxy equiv., (C) preferably 10W60pts.wt. amino resin (preferably hexamethoxymethylmelamine) and (D) preferably 0.1W40pts.wt. sensitizer (system) (e.g., 2-ethylanthraquinone) forming free radicals by active rays.
Hattori, Kenji
Tsuchiya, Katsunori
Fujii, Tadashi
