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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003131369
Kind Code:
A
Abstract:

To provide a new negative photosensitive resin composition developable with a dilute alkali solution and having good resolution, excellent etching resistance and such good removability that it is dissolved in an aqueous alkali solution.

The photosensitive resin composition comprises (A) an alkali- soluble copolymer having a terminal ethylenically unsaturated group and a carboxyl group in a side chain, (B) one or more of the photopolymerizable compounds of formula (1) having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator. In the formula (1), R1 is H or methyl; m is 0, 1 or 2; and R2 is alkylene.


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Inventors:
OBARA MIDORI
ARAI KAZUNARI
OE YASUSHI
Application Number:
JP2001326357A
Publication Date:
May 09, 2003
Filing Date:
October 24, 2001
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
G03F7/027; C08F290/02; G02B5/20; H01L21/027; (IPC1-7): G03F7/027; C08F290/02; G02B5/20; H01L21/027



 
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