To provide a photosensitive resin composition useful for production of a solid-state image sensing device or electronic parts-integrated products, small in shrinkage at curing, giving a post-cure pattern excellent in adhesion and thermal resistance (reflow resistance at 260C), free of yellowing, having moisture resistance and excellent in thermal shock resistance causing no crack or peeling even at high temperatures.

This photosensitive resin composition comprises 100 pts.mass of a specific photosensitive resin (I); 0.1-5 pts.mass of a photopolymerization initiator (II) to 100 pts.mass total of the photosensitive resin (I) and a crosslinkable monomer (III) below; and 5-1,200 pts.mass of a crosslinkable monomer (III) containing a compound expressed by CH2=CR-O-(PO)n-CR=CH2 (R represents a hydrogen atom or a methyl group; PO represents a propylene oxide group; n is an integer of 3-10). Also a method for manufacturing a plastic micro-lens or an optical device for a liquid crystal polarizer plate using the composition is disclosed.