To provide a photopolymerizable resin composition having high resolution and excellent as a resist material of an etching resist, a plating resist or the like in fields of producing a printed wiring board, a lead frame, a semiconductor package or the like and precision metal machining.
The photosensitive resin composition contains (a) 20-90 mass% of a binder resin having a carboxyl group content of 100-600 in terms of acid equivalent and a weight average molecular weight of 5,000-500,000, (b) 3-70 mass% of a photopolymerizable unsaturated group-containing compound, and (c) 0.1-20 mass% of a photopolymerization initiator, wherein the photosensitive resin composition contains a silsesquioxane compound as the photopolymerizable unsaturated group-containing compound (b). The silsesquioxane compound is preferably cage-like silsesquioxane.
| JPH10161315A | 1998-06-19 | |||
| JP2007047247A | 2007-02-22 | |||
| JP2008506978A | 2008-03-06 |
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hiroyuki Onoda
Toko Saito
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