Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013036024
Kind Code:
A
Abstract:
To provide a photosensitive resin composition giving a cured film exhibiting excellent curability of masked parts, high heat resistance, high adhesiveness and high transparency.
This active energy ray-curable photosensitive resin composition includes (A) a (meth)acrylate having a cyclic ether skeleton, (B) an alkyl(meth)acrylate in which carbon number of the alkyl group is 1-24, (C) a (meth)acrylate which is a copolymer of at least two kinds of radically polymerizable monomers, and (D) a polymerization initiator.
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Inventors:
MOTOFUJI AZUSAHEI
TOKUNAGA HIRONOBU
HIGUCHI SHINTARO
MATSUMOTO HIDETSUGU
TOKUNAGA HIRONOBU
HIGUCHI SHINTARO
MATSUMOTO HIDETSUGU
Application Number:
JP2012068578A
Publication Date:
February 21, 2013
Filing Date:
March 26, 2012
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08L33/04; C08K5/101; C08K5/151; C09D4/02; C09D7/12; C09D11/00; C09D133/00; C09D133/02; C09D133/06; C09D133/14; C09D163/10; C09J4/02; C09J11/04; C09J133/00; C09J133/02; C09J133/06; C09J133/14; C09J163/10
Domestic Patent References:
JPS5471132A | 1979-06-07 | |||
JPH10306263A | 1998-11-17 | |||
JPH0282248A | 1990-03-22 | |||
JPS63154773A | 1988-06-28 | |||
JP2003012934A | 2003-01-15 | |||
JP2006131867A | 2006-05-25 | |||
JPS63154773A | 1988-06-28 | |||
JP2003012934A | 2003-01-15 | |||
JP2006131867A | 2006-05-25 |
Foreign References:
US5925689A | 1999-07-20 | |||
WO2010143560A1 | 2010-12-16 |
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