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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014048556
Kind Code:
A
Abstract:

To provide a photosensitive resin composition from which a pattern with reduced development unevenness can be formed.

The photosensitive resin composition comprises: (A) a binder resin; (B) a polymerizable compound expressed by formula (I); and (C) a photopolymerization initiator. In formula (I), R1, R2 and R3 represent a hydrogen atom or a methyl group; and X represents -R5-O-R6-, where R5 represents a single bond or an alkylene group having 1 to 5 carbon atoms and R6 represents an alkylene group having 1 to 3 carbon atoms and having a hydroxyl group.


Inventors:
MIURA HIROYUKI
Application Number:
JP2012192903A
Publication Date:
March 17, 2014
Filing Date:
September 03, 2012
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
G03F7/027; C08F2/46; C08F20/20; G02B5/20; G02B5/22; G03F7/004; G03F7/031; H01L21/027
Domestic Patent References:
JP2010113034A2010-05-20
JP2009265630A2009-11-12
JP2010129344A2010-06-10
JP2010062120A2010-03-18
JP2011112693A2011-06-09
JP2012212030A2012-11-01
Foreign References:
WO2011138287A12011-11-10
WO2011105227A12011-09-01
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto



 
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