To provide a photosensitive resin composition from which a pattern can be formed at a low temperature.

The photosensitive resin composition comprises a binder resin (A), a polymerizable compound (B) expressed by formula (I), and a photopolymerization initiator (C). In the formula, R₁ represents a hydrogen atom or a methyl group; and X represents -R₂-O-R₃-, where R₂ represents a single bond or an alkylene group having 1 to 5 carbon atoms and R₃ represents an alkylene group having 1 to 3 carbon atoms and having a hydroxyl group. The binder resin (A) contains one of a vinyl toluene skeleton, a tricyclodecane skeleton and dicyclopentadiene skeleton. The photosensitive resin composition further contains a colorant (D). A pattern formed of the above photosensitive resin composition and a display device including the pattern are also disclosed.