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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014137429
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in solvent resistance.SOLUTION: The photosensitive resin composition comprises a polymer, a crosslinking agent and a photosensitive material. A film is formed from the photosensitive resin composition by a spin coating process and then baked on a hot plate at 100°C for 120 seconds; and the obtained layer is exposed to UV rays with energy of 300 mJ/cmand then baked in an oven at 230°C for 60 minutes to obtain a first film. The film thickness of the first film is denoted by a first film thickness. The first film is immersed in N-methylpyrrolidone at 23°C for 10 minutes. The film thickness of thus treated film is denoted by a second film thickness. The film thicknesses satisfies [{(second film thickness)-(first film thickness)}/(first film thickness)]×100≤5.

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Inventors:
IKEDA TAKAO
TAGASHIRA NOBUO
IMAMURA YUJI
ONISHI OSAMU
Application Number:
JP2013005013A
Publication Date:
July 28, 2014
Filing Date:
January 15, 2013
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/023; C08F232/00; G03F7/004; G03F7/032
Domestic Patent References:
JP2002251011A2002-09-06
JP2001337456A2001-12-07
JPH02146045A1990-06-05
JP2014520935A2014-08-25
JP2015534598A2015-12-03
Foreign References:
WO2013010190A22013-01-17
WO2006129875A12006-12-07
Attorney, Agent or Firm:
Shinji Hayami



 
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