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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017009915
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of improving controllability of a pattern profile of a sacrificial film.SOLUTION: The photosensitive resin composition is to be used to form a sacrificial film and comprises an alkali-soluble resin containing a copolymer obtained by a repeating unit derived from a norbornene monomer and a repeating unit derived from maleic acid anhydride, a photosensitive agent, and a crosslinking agent.SELECTED DRAWING: None

Inventors:
KATSURAYAMA SATORU
OTOGURO AKIHIKO
TANAKA YOSHITO
Application Number:
JP2015127863A
Publication Date:
January 12, 2017
Filing Date:
June 25, 2015
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/023; C08F222/02; C08F222/06; C08F222/10; C08F232/08; G03F7/004
Domestic Patent References:
JP2013064988A2013-04-11
JP2005004004A2005-01-06
JP2007316282A2007-12-06
JP2014232233A2014-12-11
JP2015007770A2015-01-15
JP2011107170A2011-06-02
JP2010248373A2010-11-04
JP2014074893A2014-04-24
JP2013218265A2013-10-24
JP2012215826A2012-11-08
JP2003255546A2003-09-10
Foreign References:
US20150079507A12015-03-19
US20110104614A12011-05-05
Attorney, Agent or Firm:
Shinji Hayami