Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3121213
Kind Code:
B2
Abstract:
PURPOSE: To obtain a photosensitive resin compsn. which is excellent in adhesion to a plating metal, resolving power, photocurability, thermal curability, and heat resistance and enables the use of an aq. alkali soln. or an aq. soln. contg. an org. nonhalogen solvent as a developing soln.
CONSTITUTION: The compsn. comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reaction product of a carboxylated acrylonitrile-butadiene rubber with an epoxy resin, a photopolymn. initiator, and a thermal curing agent, provides a high-density high-reliability built-up printed circuit board, and enables the use of a treating process free from problems with environmental pollution or safety.
Inventors:
Yoshinori Kawai
Mineo Kawamoto
Junichi Katagiri
Masanori Nemoto
Akio Takahashi
Mineo Kawamoto
Junichi Katagiri
Masanori Nemoto
Akio Takahashi
Application Number:
JP17511094A
Publication Date:
December 25, 2000
Filing Date:
July 27, 1994
Export Citation:
Assignee:
株式会社日立製作所
日立化成工業株式会社
日立化成工業株式会社
International Classes:
G03F7/038; C08G59/00; C08G59/16; C08G59/18; C08L9/02; C08L63/00; H05K1/00; H05K3/36; H05K3/46; H05K3/00; (IPC1-7): C08L63/00; C08G59/16; C08L9/02; G03F7/038; H05K3/46
Domestic Patent References:
| JP3172317A | ||||
| JP61243869A | ||||
| JP7224149A | ||||
| JP7330865A | ||||
| JP841146A |
Attorney, Agent or Firm:
Yasuo Sakuta