Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3745575
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition developable with an alkaline aqueous solution, having high sensitivity and capable of easily forming a patterned thin film excellent in low dielectric property as well as in various characteristics such as insulating property, flatness, heat and solvent resistances and transparency and a processing method for the composition.
SOLUTION: The photosensitive resin composition is a negative type photosensitive resin composition containing a copolymer containing at least styrene and maleic acid amide, a polymerizable monomer, a photopolymerization initiator and a fluorine compound. In the processing method, the composition is washed with ultrahigh pressure micro-jets of water after coating, exposure and alkali development.
Inventors:
Yoshihiro Takagi
Application Number:
JP2000054145A
Publication Date:
February 15, 2006
Filing Date:
February 29, 2000
Export Citation:
Assignee:
FUJIFILM Electronics Materials Co., Ltd.
International Classes:
G03F7/004; C08F2/44; C08F2/50; C08F257/02; C08F267/10; C08K5/00; C08L25/08; C08L35/00; C08L63/00; G02F1/13; G02F1/1335; G02F1/136; G02F1/1368; G03F7/027; G03F7/028; G03F7/033; G03F7/30; H01L21/027; (IPC1-7): G03F7/004; C08F2/44; C08F2/50; C08F257/02; C08F267/10; C08K5/00; C08L25/08; C08L63/00; G03F7/027; G03F7/033; G03F7/30; H01L21/027
Domestic Patent References:
| JP5265208A | ||||
| JP11326626A | ||||
| JP9244225A | ||||
| JP2000026772A |
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hagino Taira
Zenichi Soeda
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hagino Taira
Zenichi Soeda