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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3967825
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resist releasing ability, resolution, and fine line adhesion.
SOLUTION: In a photosensitive resin composition which comprises a base polymer (A), an ethylenically unsaturated compound (B), a photopolymerization initiator (C), a plasticizer (D) (especially, p-toluenesulfonamide) and a dye (E), a copolymer (al) having a weight-average molecular weight of 50,000 to 70,000 and a copolymer (a2) having a weight-average molecular weight of more than 70,000 and not more than 100,000 are included as the base polymer (A), at least one of the copolymers (a1) and (a2) having an acid number of 130 mg KOH/g, and a lophin dimer (c1) is further included (preferably, an acridine derivative (c2) is further included) as the photopolymerization initiator (C).


Inventors:
Murakami, Shigeru
Kosaka, Eiji
Fujimoto, Naohiko
Application Number:
JP1998000142318
Publication Date:
August 29, 2007
Filing Date:
May 08, 1998
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD:THE
International Classes:
G03F7/004; G03F7/033; C09D4/06; C09D5/00; G03F7/027; G03F7/028; G03F7/031; H01L21/027; (IPC1-7): G03F7/033; C09D5/00; G03F7/004; G03F7/027; G03F7/028; G03F7/031; H01L21/027; //C09D4/06
Domestic Patent References:
JP8157744A
JP63266448A
JP7333846A
JP7028232A
JP3017650A
JP10110008A
JP4152347A