Title:
感光性樹脂組成物
Document Type and Number:
Japanese Patent JP7026606
Kind Code:
B2
Abstract:
A photosensitive resin composition containing an alkali-soluble polymer, a compound having an ethylenic double bond, and a photopolymerization initiator, wherein the photosensitive resin composition is characterized in that: a photosensitive resin layer comprising the photosensitive resin composition is laminated to a thickness of 25 μm onto a copper-clad laminated plate laminated with 18-μm-thick copper foil; a cured resist pattern is formed through light irradiation in a pattern where the line/space ratio is 50 μm/30 μm and a development treatment; and a copper etching process is performed for 55 seconds at 50℃, whereupon the bottom width of the copper line pattern obtained by removing the cured resist pattern is 38 μm or greater.
Inventors:
Kazuya Naito
Yuri Yamada
Hayako Kosaka
Yuri Yamada
Hayako Kosaka
Application Number:
JP2018231215A
Publication Date:
February 28, 2022
Filing Date:
December 10, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/027; C08F2/50; C08F290/06; G03F7/004; G03F7/031; G03F7/032; G03F7/20; G03F7/40; G03F7/42; H05K3/06; H05K3/18
Domestic Patent References:
| JP2014182305A | ||||
| JP2015060120A | ||||
| JP2012226254A |
Foreign References:
| US20130266900 | ||||
| WO2016047691A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma