Title:
感光性樹脂組成物
Document Type and Number:
Japanese Patent JP7242748
Kind Code:
B2
Abstract:
A photosensitive resin composition comprises an alkali-soluble polymer, a compound having an ethylenically unsaturated bond and a photopolymerization initiator, and has such a property that, when a photosensitive resin layer made from the photosensitive resin composition is formed on the surface of a substrate, then the photosensitive resin layer is exposed to light and is developed to form a resist pattern, and then the resist pattern is treated with a chemical solution for chemical solution resistance evaluation use, the smallest line width of the cured resist lines is 17 μm or less.
Inventors:
Shinichi Kunimatsu
Takayuki Matsuda
Yuri Yamada
Yamato Tsutsui
Akira Fujiwara
Takayuki Matsuda
Yuri Yamada
Yamato Tsutsui
Akira Fujiwara
Application Number:
JP2021077956A
Publication Date:
March 20, 2023
Filing Date:
April 30, 2021
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/027; G03F7/029; G03F7/031; G03F7/033; G03F7/20; G03F7/40; G03F7/42; H05K3/06
Domestic Patent References:
| JP2007086224A |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
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