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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6259946
Kind Code:
A
Abstract:

PURPOSE: To obtain a photosensitive resin composition having an excellent release property, tinting characteristic and plating resistance by incorporating specific ethylenic unsatd. compds. into the photosensitive resin compsn.

CONSTITUTION: ≥1 Kinds of the ethylenic unsatd. compds. selected from the compd. expressed by the formula I (a and b are such integers at which the sum thereof makes 6, m is 1, 2), the pentaerythritol acrylate expressec by the formula II, the bisphenol A polyoxyethylene dimethacrylate (m and n are such integers at which the sum thereof makes 10) and the trimethyl propane trimethacrylate expressed by the formula IV are incorporated into the photosensitive resin compsn. contg. a film property lendering polymer, org. halogen compd. and sensitizer system which can form free radicals by active rays. The photosensitive resin compsn. having the excellent release property and the good tinting characteristic and plating resistance is obtd. by combining any of the above- mentioned compsn. expressed by the formulas IWIV. The photosensitive resin compsn. is thus made usable as a resist material for etching and plating in production of printed circuit boards, precision working of metals, etc.


Inventors:
Nakasaki, Hideo
Masaoka, Kazutaka
Minami, Yoshitaka
Kakumaru, Hajime
Application Number:
JP1985000200370
Publication Date:
March 16, 1987
Filing Date:
September 10, 1985
Export Citation:
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Assignee:
HITACHI CHEM CO LTD
International Classes:
G03C1/00; G03F7/004; G03F7/027; G03F7/029; H01L21/027; H05K3/00; (IPC1-7): G03C1/00
Domestic Patent References:
JPS60225149A
JPS60225841A