Title:
感光性樹脂組成物、感光性シート、半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6743692
Kind Code:
B2
Abstract:
A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5s in the same molecule may be the same or different.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.
Inventors:
Hiroyuki Onishi
Yuki Masuda
Yuki Masuda
Application Number:
JP2016511459A
Publication Date:
August 19, 2020
Filing Date:
February 29, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
G03F7/004; G03F7/023; G03F7/20; G03F7/40
Domestic Patent References:
| JP2013254081A | ||||
| JP2010211095A | ||||
| JP2007163756A | ||||
| JP2005234434A | ||||
| JP3107160A | ||||
| JP2007220775A |