PURPOSE: To obtain a photosensitive resin insulation material having excellent adhesivity and suitable e.g. for a multilayer printed circuit board having an electroless plating film formed in high reliability by including specific heat- resistant particles capable of dissolving an oxidizing agent and having a specific heat resistance in a photosensitive resin scarcely dissolving the oxidizing agent.

CONSTITUTION: Heat-resistant particles capable of dissolving an oxidizing agent such as chromic acid (salt) or ozone and consisting of agglomerated particles having an average particle diameter of 2-10μm and obtained by agglomerating fine powder of a heat-resistant resin having an average particle diameter of ≤2μm are included in a photosensitive resin such as epoxy resin capable of scarcely dissolving the oxidizing agent. The amount of the heat-resistant particle is preferably 5-35 pts.wt. based on 100 pts.wt. of the solid component of the photosensitive resin scarcely dissolving the oxidizing agent.