Title:
マイクロ流路用感光性樹脂積層体
Document Type and Number:
Japanese Patent JP7216365
Kind Code:
B2
Abstract:
To provide a photosensitive resin laminate for a micro flow passage device which has an excellent sealing property and has no flow passage blocking property and/or has an excellent waterproofness, and a sealing material for a micro flow passage device and a micro flow passage device using the photosensitive resin laminate as a dry film.SOLUTION: The photosensitive resin laminate for a micro flow passage device includes a supporting film and a photosensitive resin composite layer, (1) the photosensitive resin composite layer having a film thickness of 1-15 μm and having a melt viscosity of 100,000 mPa s or smaller at 70°C, and (2) the rate I/O of an inorganic value (I) and an organic value (O) of the photosensitive resin composite layer being not larger than 1.0.SELECTED DRAWING: None
Inventors:
Hidenori Nagai
Shunsuke Furuya
Yuzo Kotani
Shunsuke Furuya
Yuzo Kotani
Application Number:
JP2018186690A
Publication Date:
February 01, 2023
Filing Date:
October 01, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
National Institute of Advanced Industrial Science and Technology
National Institute of Advanced Industrial Science and Technology
International Classes:
G01N35/08; B32B27/00; G03F7/004; G03F7/027
Domestic Patent References:
JP2007086723A | ||||
JP2006142198A | ||||
JP2013164311A | ||||
JP2008175795A | ||||
JP2012073600A | ||||
JP2017119340A | ||||
JP2006293039A | ||||
JP2009134255A |
Foreign References:
WO2009110270A1 | ||||
WO2009001492A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
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