PHOTOSENSITIVEE RESIN COMPOSITION

Title:

PHOTOSENSITIVEE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JPH0844059

Kind Code:

A

Abstract:

PURPOSE: To obtain a photosensitive resin compsn. which is cured by irradiation with UV, can be washed with water and is useful as a soldering resist for a printed circuit board, marking ink, etc.

CONSTITUTION: This photosensitive resin compsn. contains a prepolymer, a photopolymn. initiator and a reactive diluent as essential components. The prepolymer is obtd. by copolymerizing a (meth)acrylic ester with a hydroxyl group-contg. (meth)acrylic ester and an epoxy group-contg. (meth)acrylic ester and introducing (meth)acryloyl groups into part of the epoxy groups of the resultant copolymer and onium-contg. groups into the remainder.

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Inventors:

YANAGAWA MAKOTO
YAMAMOTO HIROSHI
NISHIYAMA HIROSHI

Application Number:

JP17922294A

Publication Date:

February 16, 1996

Filing Date:

July 29, 1994

Export Citation:

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Assignee:

TAMURA KAKEN CO LTD

International Classes:

G03F7/004; C08F290/00; C08F290/12; C09D11/00; C09D11/10; G03F7/027; G03F7/028; G03F7/038; H05K3/06; H05K3/28; (IPC1-7): G03F7/027; C08F290/12; C09D11/00; G03F7/004; G03F7/028; G03F7/038; H05K3/06; H05K3/28

Attorney, Agent or Firm:

Agata Akira (1 person outside)

Next Patent: PRODUCTION OF PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN