To provide a novel photosetting composition which can be cured by light of a wide range of wavelength regions including UV light or visible light, is high in sensitivity, can make sufficient curing obtainable with little exposure, can adequately form minute patterns when used as a resist, and forms cured matter having excellent heat resistance and insulation characteristics, and a negative photoresist composition using the same.
The photosetting composition contains (A): a carbon cluster having a photosensitizing effect and/or its derivative, (B): a compound having a plurality of heterocycles within the molecule, and if necessary, (C): a non-photosensitive resin. Also, the composition preferably contains a compound having a siloxane bond within the molecule. The photosetting composition which is adequately usable as the negative photoresist composition, can form the minute patterns with high sensitivity characteristics and can manufacture a cured film having excellent heat resistance, chemical resistance and insulation characteristics is obtained. If such photosetting composition is used, the manufacture of semiconductor elements, liquid crystal elements, etc., and the manufacture of photosensitive insulating films usable in the field of packaging of the respective elements with a little heat history/photoirradiation history are made possible.
YOKOYAMA YASUAKI
BESSHO NOBUO
Koji Makimura
Chihata Takahata
Toru Suzuki
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