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Title:
PHOTOSETTING RESIN COMPOSITION AND COATING MATERIAL
Document Type and Number:
Japanese Patent JP2001002742
Kind Code:
A
Abstract:

To obtain a photosetting resin composition that has excellent film hardness, fouling resistance and chemical resistance after photosetting, and obtain a coating material that shows excellent film hardness, fouling resistance and chemical resistance after photosetting, excellent in handleability because of its low viscosity and in inexpensiveness and can be applied in the form of a non-solvent type coating material.

The photosetting resin composition comprises (A) an unsaturated double bonds-bearing urethane compound that is prepared by allowing (a) an isocyanate bearing at least 2 isocyanate groups in one molecule to react with (b) an unsaturated compound bearing at least one photosetting unsaturated double bond and at least one hydroxy group in one molecule and (c) a glycol represented by the general formula: HO-(X-O)a-H (X is an alkylene group with a carbon number of 2-6; (a) is an integer of 1-15), (B) a photosetting monomer bearing at least one photosetting unsaturated double bond, and (C) a photoplymerization initiator.


Inventors:
OYASU KENICHI
HAMADA KEIJI
KONDO SHUICHI
Application Number:
JP17395199A
Publication Date:
January 09, 2001
Filing Date:
June 21, 1999
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F290/06; C09D175/14; (IPC1-7): C08F290/06; C09D175/14
Attorney, Agent or Firm:
Kunihiko Wakabayashi