To provide a photosetting resin composition having high sensitivity and excellent dry-to-touch property, suppressing generation of outgas, and having excellent alignment accuracy and high productivity and reliability as a solder resist.

The photosetting resin composition comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin described below, and a compound having two or more ethylenically unsaturated groups in the molecule. The resin is one of: (A) a COOH group-containing urethane resin; (B) a COOH group-containing urethane resin to which an acid anhydride is reacted; (C) a COOH group-containing photosensitive urethane resin; (D) a COOH group-containing urethane resin to which a hydroxyl group and a (meth)acryloyl group-containing compound are added during synthesizing (A) or (C); (E) a COOH group-containing urethane resin to which an isocyanate group and a (meth)acryloyl group-containing compound are added during synthesizing (A) or (C); (F) a COOH group-containing photosensitive resin derived from a polyfunctional epoxy resin; and (G) a COOH group-containing photosensitive resin derived from a bifunctional epoxy resin.