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Title:
PHOTOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS56100817
Kind Code:
A
Abstract:

PURPOSE: A photosetting resin composition, capable of forming a coat with excellent adhesion to a base material, which is prepared by compounding a mixture of an unsaturated polyester, a polymerizable monomer and a photosensitizer with a mixture of an epoxy resin and a photosensitive aromatic onium salt.

CONSTITUTION: An unsaturated polyester (or unsaturated epoxy ester) of average MW 300W1,500 per α,β-unsaturated double bond is diluted with a monomer (e.g., styrene) having 1W4 unsaturated double bonds to obtain a mixture about 1W5 times as heavy as the polyester, and then about 0.5W10wt% radical photosensitizer (e.g., benzoin) is added, to prepare component (A). On the other hand, about 0.5W10wt% photosensitive aromatic onium salt of a Group VIa or Group Va element (e.g., triphenylsulfonium tetrafluoro borate) is added to an epoxy resin (e.g., a bisphenol A-type epoxy resin) having at least two oxirane rings, to prepare component (B). Then the both components are compounded in a proportion of A/B of 90/10W10/90, in weight.


Inventors:
TERADA IKUTA
ISOBE ASAO
KOIBUCHI SHIGERU
Application Number:
JP401680A
Publication Date:
August 13, 1981
Filing Date:
January 16, 1980
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F2/00; C08F2/48; C08F2/50; C08F299/02; C08G59/00; C08G59/40; C08L67/00; C08L67/06; C09D4/00; (IPC1-7): C08F2/50; C08F299/02



 
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