Title:
光起電力モジュールの封止材
Document Type and Number:
Japanese Patent JP7128395
Kind Code:
B2
Abstract:
An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell (10), including: a copolymer of ethylene-alkyl acrylate, the melt flow index (MFI) of the copolymer being 1 g/10 min to 40 g/10 min; and a silane making up 0.1% to 0.5% of the weight of the composition; wherein the encapsulant also includes a cross-linking agent making up 0.1% to 0.5% of the weight of the composition and wherein the copolymer makes up at least 99% of the weight of the composition. Also, a use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.
Inventors:
Jack, Guillaume
Bizet, Stephane
Savigna, Benoit
Kane, Molly
Bizet, Stephane
Savigna, Benoit
Kane, Molly
Application Number:
JP2016575929A
Publication Date:
August 31, 2022
Filing Date:
June 26, 2015
Export Citation:
Assignee:
SK Geocentric Company Limited
International Classes:
C08L33/08; C08K5/14; C08K5/5425; H01L31/048
Domestic Patent References:
| JP2006159497A | ||||
| JP2012190878A | ||||
| JP6299125A |
Foreign References:
| WO2007094445A1 |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation
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