Title:
物理量センサ及びその製造方法
Document Type and Number:
Japanese Patent JP4481323
Kind Code:
B2
Abstract:
There is provided a physical sensor that ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same.
A physical sensor (50) e.g. an accelerometer or angular rate sensor includes a supporting substrate (2), an element substrate (1) that includes a sensor element (30) and is joined to the supporting substrate (2) through an insulating layer (3), e.g. a SOI substrate, a glass cap (12) that covers the area of the sensor element (30) and is joined to the element substrate (1), and a built-in electrode (10) that is electrically connected to the sensor element (30). The built-in electrode (10) is formed in a through hole or via passing through the element substrate (1), the insulating layer (3) and the supporting substrate (2). A portion of the glass cap (12) that covers an area of the built-in electrode (10) is anodically bonded to the element substrate (1), to ensure hermetic sealing even when the via is not completely filled.
Inventors:
Kengo Suzuki
Takeshi Harada
Yasuo Ozone
Masahide Hayashi
Akashi Teruhisa
Takeshi Harada
Yasuo Ozone
Masahide Hayashi
Akashi Teruhisa
Application Number:
JP2007189657A
Publication Date:
June 16, 2010
Filing Date:
July 20, 2007
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
H01L29/84; G01C19/56; G01C19/574; G01C19/5747; G01C19/5769; G01P15/08; H01L23/02
Domestic Patent References:
| JP6109755A | ||||
| JP8316762A |
Foreign References:
| WO1999013343A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation