Title:
Physical quantity sensor and its manufacturing method
Document Type and Number:
Japanese Patent JP6315025
Kind Code:
B2
Abstract:
Instead of insert molding a mold member with a resin case to integrate it, a filler is filled into a first opening formed in the resin case while the mold member is disposed therein, whereby integration is performed. This makes it possible to suppress peeling between the mold member and the resin case due to a thermal cycle, and also makes it possible to suppress leakage of a measurement medium to the outside through a gap between the mold member and the resin case.
Inventors:
Noriya Hirasawa
Takuya Sato
Takuya Sato
Application Number:
JP2016088350A
Publication Date:
April 25, 2018
Filing Date:
April 26, 2016
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01L19/14; G01L9/00
Domestic Patent References:
| JP4497219B2 | ||||
| JP6128002B2 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office
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