PURPOSE: To provide a pressure sensor and an acceleration sensor capable of being miniaturized at a low cost by utilizing the wiring pattern of a printed wiring board.

CONSTITUTION: A metal thin film made of copper is formed on the surface of a board 1 made of a base material for the printed board such as an epoxy resin board, and the metal thin film is patterned into a prescribed shape. The board 1 is dissolved from the back face of it to bore a through hole 4, and a diaphragm 3 integrated with a wiring pattern 2 is formed. A metal cover 5 is provided at a fine gap on the upper face of the diaphragm 3, chip parts 7 are mounted on the wiring pattern 2 to form a signal processing circuit 6, and a pressure sensor A is manufactured.