PURPOSE: To obtain an apparatus whose structure is not complicated and which can shorten the time required for picking up a chip component by installing a cam member which is turned around the central axis nearly parallel to an adhesive face of an adhesive tape, which acts on the adhesive tape from the side of the adhesive face and which energizes the adhesive tape in a direction distant from a collet.

CONSTITUTION: At this apparatus, a chip component 12 which has been bonded and fixed to an adhesive face of an adhesive tape 11 whose adhesive power is lowered by irradiation with an energy beam 20 is held by using a collet 17, is stripped off from the adhesive tape 11 and is picked up. The apparatus is provided with cam members 18 which are turned around the rotation central axis nearly parallel to the adhesive face, which act on the adhesive tape 11 from the side of the adhesive face and which energize the adhesive tape 11 in a direction distant form the collet 17. For example, said cam members 18 are nearly square plate cams and energize an adhesive tape 11 at their corner-part outside faces in a direction distant from a collet 17. The cam members 18 can be raised or lowered together with the rising and falling operation of the collet 17 and can be raised or lowered relatively to the rising and falling operation of the collet 17.