Title:
ピックアップ装置、実装装置、ピックアップ方法、実装方法
Document Type and Number:
Japanese Patent JP6821749
Kind Code:
B2
Abstract:
To prevent adhesion of an adjacent heat conduction sheet at a time of picking up the heat conduction sheet.SOLUTION: The pickup device includes: a stage 2 on which a thermally conductive molded sheet 20 having a plurality of thermally conductive sheets 21 that are cut into small pieces by being provided with notches; and a transfer head 3 for picking up and moving the thermally conductive sheets 21 from the thermally conductive molded sheet 20 mounted on the stage 2. The thermally conductive molded sheet 20 has magnetism. At least one of the stage 2 and the transfer head 3 is provided with a holding mechanism 4 for magnetizing and holding at least one of the thermally conductive molded sheet 20 and the thermally conductive sheets 21.SELECTED DRAWING: Figure 1
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Inventors:
Keisuke Aramaki
Hiroyuki Yoshitaka
Volotov Sergey
Yusuke Kubo
Tobata Marina
Hiroyuki Yoshitaka
Volotov Sergey
Yusuke Kubo
Tobata Marina
Application Number:
JP2019130427A
Publication Date:
January 27, 2021
Filing Date:
July 12, 2019
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H05K13/04; H01L23/36
Domestic Patent References:
| JP2017175080A | ||||
| JP2015139835A | ||||
| JP2009123766A |
Attorney, Agent or Firm:
Nobuhiro Noguchi