To provide a pickup device of a semiconductor die, which suppresses a force applied to the semiconductor die when a holding sheet is peeled off and simultaneously picks up the semiconductor die easily.

The pickup device includes a stage 20 including an adhesion face 22 for adhering to the holding sheet 12, a sucking opening 41 provided on the adhesion face 22, a lid 23 for opening and closing the sucking opening 41 by sliding along the adhesion face 22, and a collet 18 for adhering the semiconductor die 15. When the semiconductor die 15 is picked up, a tip end 23a of the lid 23 is moved from the adhesion face 22, the lid 23 is slid while pushing up the holding sheet 12 and the semiconductor die 15, and the sucking opening 41 is sequentially opened. The holding sheet 12 is sequentially sucked to the opened sucking opening 41 to sequentially peel off the holding sheet 12 from the semiconductor die 15, and the semiconductor die 15 is sequentially sucked by the collet 18 waiting above the semiconductor die 15 to pick up the semiconductor die 15.