PURPOSE: To prevent peeling due to a temperature change of an added mass, by making coefficients of thermal expansion of an added mass and a metal plate bonded on an element approximate that of the element.
CONSTITUTION: A piezoelectric element 6 is stuck at the center of a metal plate and an added mass 10 is bonded on the outer surface of the piezoelectric element 6: the added mass 10 and the metal plate 5 are made of material with the coefficient of thermal expansion thereof approximating that of a piezoelectric element. In a high temperature hardening processing of an adhesive, there is no internal stress left at an adhesion part regardless of a temperature change or a change in the ambient temperature, thereby almost eliminating a problem of the added mass being peeled off.
HANAMOTO KOJI
FUJIMOTO KATSUMI
INOUE JIRO
JPS6318271A | 1988-01-26 | |||
JP61187463B | ||||
JP52140374B | ||||
JPS6341080A | 1988-02-22 | |||
JPS62190774A | 1987-08-20 |