To provide a piezoelectric device in which the connection part of a piezoelectric vibrating reed is not easily broken by shock from the outside and which has a structure advantageous to miniaturize a package, and also to provide its manufacturing method, and a portable telephone and electronic equipment by using the piezoelectric device.

In this piezoelectric device 30 housing the piezoelectric vibrating piece 32 in the package 37, the piezoelectric vibrating piece 32 is fixed to an insulating substrate in the package by a non-conductive adhesive 43 with low elasticity in a cured state, and the piezoelectric vibrating piece is connected to electrode parts 31, 31 formed on the insulating substrate by wire bonding.