To provide a piezoelectric device which can be manufactured in lower cost, and a method of manufacturing the same.

A piezoelectric device 100A has a piezoelectric vibration piece 10 which vibrates upon application of a voltage, a first plate 12A having a recess portion 121 in which the piezoelectric vibration piece is mounted, and an end face formed so as to go around the recess portion, a second plate which is joined to the end face of the first plate to hermetically put the piezoelectric vibration piece in the recess portion 121, adhesive agent 124 which is annularly formed so as to go around the end face and disposed on the end face to join the first plate and the second plate, and metal films 113, 123 which are annularly formed so as to go around the end face and disposed at the recess portion side of the adhesive agent to prevent gas occurring from the adhesive agent from flowing into the recess portion.