To provide a piezoelectric device which is improved in mounting yield.
The piezoelectric device 10 includes a piezoelectric vibrator 16 having an external electrode 12 on one surface and having a lid 14 on the opposite surface, an IC chip 18 having a circuit for driving the piezoelectric vibrator 16, and a lead frame 20 connecting the piezoelectric vibrator 16 and the IC chip 18. The IC chip 18 is connected to one surface of the lead frame 20, and the external electrode 12 is connected to another surface of the lead frame 20. The lead frame 20 includes a level difference in a direction where the connection surface with the IC chip 18 of the lead frame 20 is composed to the connection surface with the external electrode 12 of the lead frame 20.
SHIMODAIRA KAZUHIKO
Osamu Suzawa
Kazuhiko Miyasaka