Title:
PIEZOELECTRIC DEVICE
Document Type and Number:
Japanese Patent JP2009239415
Kind Code:
A
Abstract:
To provide an electronic device which prevents an adverse effect to a sealing resin by soldering.
In the electronic device 10 composed by mounting an IC chip 16 on a ceramic base 12 and sealing the periphery of the IC chip 16 with a resin 20, the resin 20 is exposed to an upper layer part of a device side face, the ceramic base 12 is exposed to a lower layer part thereof, a notched part 22 is formed in the lower region of the ceramic base 12, and a mounting electrode 24 is formed on the notched surface 22a.
Inventors:
SHIMODAIRA KAZUHIKO
Application Number:
JP2008079917A
Publication Date:
October 15, 2009
Filing Date:
March 26, 2008
Export Citation:
Assignee:
EPSON TOYOCOM CORP
International Classes:
H03H3/02; H03B5/32; H03H9/02
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka
Osamu Suzawa
Kazuhiko Miyasaka