To provide a piezoelectric device, in which an element can be heated with less energy and moreover, heat transfer to the outside of a package is suppressed.
A piezoelectric device 100 includes a package 10, a piezoelectric element 20 housed inside the package 10, and a heater element 30 housed inside the package 10. The piezoelectric element 20 includes a base 22 and a beam 24 extending from the base 22 and is fixed to the base 22 in a cantilevered or double-supported beam shape; the heater element 30 includes a supporting part 32 and a heat generating part 34 supported by the support part 32 away from the package 10; and the heat-generating part 34 is fixed by the support part 32, in a cantilevered shape or double-supported shape of shape, and the heat generating part 34 and the beam 24 are mutually separated.
JP2009005117A | 2009-01-08 | |||
JP2001500715A | 2001-01-16 | |||
JP2003224422A | 2003-08-08 | |||
JP2000002571A | 2000-01-07 | |||
JPS5553210U | 1980-04-10 | |||
JPS55119381A | 1980-09-13 | |||
JP2007222990A | 2007-09-06 | |||
JP2009005117A | 2009-01-08 | |||
JP2001500715A | 2001-01-16 | |||
JP2003224422A | 2003-08-08 | |||
JP2000002571A | 2000-01-07 |
Mitsue Obuchi
Misa Nagata
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