To omit an electronic beam radiation process and to complete the fixture of a piezoelectric vibrator at the same time, circuit component and metal case to a printed circuit board through the simplified process by using a creamy solder, as a means for fixing the upper surface of the piezoelectric vibrator onto the ceiling surface of the metal case, and solidifying that solder through a reflow system.

For the production of a piezoelectric oscillator which uses a crystal oscillator, a crystal vibrator 2 and an electronic component 3 placed on a wiring pattern on a printed circuit board 1 are placed through the cream solder, and furthermore the creamy solder is interposed between the upper surface of a metal lid 2a of the crystal vibrator 2 and the ceiling surface of a metal case 4 for electromagnetic shield. By heating thus assembled respective components at a prescribed temperature inside a reflow furnace and cooling them later, the fixture of the respective components, namely, the printed circuit board 1, metal lid 2a, electronic component 3 and metal case 4 is completed at the same time while using the cream solder.