To solve a problem that a bonded part exfoliates by self-weight of a piezoelectric oscillation element in a duration of insufficient fixing strength of electrically conductive adhesive due to its uncured state when the electrically conductive adhesive supports one end of the piezoelectric oscillation element on a small-sized circuit component such as a chip part or the like.

The piezoelectric oscillator is provided with a package body 21 having an outside electrode at the bottom and a conducting pad 21b for mounting an IC conducted with the outside electrode at the upper side, an IC chip 22 conduction-connected on the conducting pad of the package body, an piezoelectric oscillation element 23, at least whose one end edge is supported onto the upper electrode 22c at the top of the IC chip by conductive adhesive B, and a covering member 24 for hermetically sealing the upper package body including the IC chip and the piezoelectric oscillation element. The IC chip has a length exceeding a distance from the one end edge to a barycentric position of the piezoelectric oscillation element.