To improve the strength of the film element itself and to reduce the disturbance of piezoelectric vibrations despite the high mechanical strength of the support of a piezoelectric thin film by providing a 2nd support which holds a vibration part and a 1st support which holds the 2nd support.
A 1st piezoelectric thin film driving electrode 4, a piezoelectric thin film 5 and a 2nd piezoelectric thin film driving electrode 6 are formed on a 2nd support 3. The support 3 covers a 1st support 2 and a substrate 1 and is held by the support 2. The support 3 has plural etching holes 7 formed along the outer edge of the film 5 in a slit shapes, and the parts forming no holes 7 are used as the connection parts. The substrate 1 placed under the support 2 has a cavity part 8 where the support 2 is connected to the substrate 1 in a bridge shape. Then the part of the support 2 that is corresponding to to the lower part of a vibration part is removed.
MAEDA CHISAKO
UMEMURA TOSHIO
UCHIKAWA HIDEFUSA
HONDA TOSHIHISA
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