To provide a high-reliable piezoelectric vibration device having no possibility of causing a short-circuit or the like even in the case of being miniaturized and capable of obtaining a required hold strength without increasing the coating quantity of a conductive bonding material for holding a piezoelectric diaphragm.

In the piezoelectric vibration device in which a piezoelectric diaphragm 2 formed with an exciting electrode and a deriving electrode for connecting the relevant exciting electrode to the outside is packaged on the upper face of conductive pads 12 and 13 and held by the conductive bonds while using a ceramic package 1 formed with the relevant conductive pads, said conductive pads have base portions 121 and 131 connected with external terminals and protruding portions 122 and 132 for holding the piezoelectric diaphragm near its terminal parts, and said base portions are formed wider than the protruding portions.