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Patent Searching and Data


Title:
バイオチップ用ピラー構造体
Document Type and Number:
Japanese Patent JP6688390
Kind Code:
B2
Abstract:
Technology for a pillar structure for a biochip is disclosed. The pillar structure for a biochip includes: a substrate portion having a plate structure; an insertion pillar portion formed in one piece with the substrate portion and protruding downward from a lower surface of the substrate portion so as to be inserted into a well; and a compensation pillar portion formed in one piece with the substrate portion, the compensation pillar portion corresponding to the insertion pillar portion and protruding upward from an upper surface of the substrate portion. Therefore, when the pillar structure is cooled during an injection molding process, the substrate portion is prevented from being partially recessed, and when samples are analyzed using microscopic images, accuracy and reliability may be improved.

Inventors:
Lee, Dong Jung
Song, Ho Jung
Lee, Dong Woo
Nam, Do Hyun
Application Number:
JP2018529096A
Publication Date:
April 28, 2020
Filing Date:
December 12, 2016
Export Citation:
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Assignee:
MBD Company Limited
Samsung Life Public Welfare Foundation
International Classes:
C12M1/00; B01L3/00
Domestic Patent References:
JP2004122751A
JP2014022715A
Foreign References:
US20130184182
US20140134652
WO2010021306A1
US20120309649
US20060057580
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori